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Temperature field boundary conditions: In simulation calculations, the chips are used as heat sources, and the power losses are directly loaded on the power module to simulate the heat of the chips. When the device is in a long-term state, the total power losses of the module will be composed of the loss of the IGBT chips and the SBD chips. After calculation, the loss of an IGBT chip is 115 W, and the loss of an SBD chip is 20 W. According to the actual work situation, the ambient temperature is 25 °C, and the convective heat transfer coefficient between the surface of the heatsink and the air is 5 W·(m 2 ·°C) −1 . It can be found from the above figure that the temperature and thickness in the same layer almost show a linear relationship, which is closely related to the thermal conductivity of each layer of materials. The temperature change of materials with small thermal conductivity is relatively large. Due to the use of liquid cooling, the substrate temperature changes only 4.32 °C after 3 mm, reaching 49.2 °C under the heatsink. The most obvious temperature change is in the DBC ceramic layer; only the 0.38 mm thick ceramic layer has a temperature change as high as 14 °C, which is because of the low thermal conductivity of the ceramic layer. In addition to using water-cooled heatsinks instead of air-cooled heatsinks, materials with higher thermal conductivity can also be selected to increase the heat transfer capacity. The thermal conductivity is manifested in the slope of temperature change in the figure. For example, for this paper, nano-silver solder (thermal conductivity of 240 W·m −1 ·K −1 ) was selected as the chip solder layer to replace the traditional SAC305 (thermal conductivity of 32.7 W·m −1 ·K −1 ). In addition, for the DBC ceramic layer, AlN (thermal conductivity of 319 W·m −1 ·K −1 ) was also be used to replace the original Al 2 O 3 (thermal conductivity of 25 W·m −1 ·K −1 ). Santos laguna x monterrey.Bola De Futebol Americano Preta Vollo. Bola Futebol Americano Nfl Wilson Tailgate.
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